GOB LED Modules

The GOB LED Modules Collection provides a professional selection of indoor and outdoor LED display modules combining established SMD LED technology with an additional Glue-on-Board protective surface layer. Covering pixel pitches from P1.25 to P2.5, the collection includes standard indoor GOB modules, integrated indoor GOB modules, indoor flexible GOB modules, and high-brightness outdoor GOB modules for professional display projects requiring detailed image quality, high refresh performance, and enhanced LED surface protection.

Available module formats include 240×120mm, 320×160mm, and 320×480mm, with front-service standard modules, integrated module structures, flexible PCBs, soft back shells, magnetic mounting, screw-lock installation, and rear-service outdoor configurations. Indoor models support conference rooms, broadcast studios, control rooms, command centers, corporate displays, retail stores, museums, exhibition halls, airports, experience centers, immersive spaces, and curved LED installations, while outdoor models support digital signage, commercial advertising screens, DOOH displays, transportation information systems, and other high-resolution outdoor LED display projects.

GOB Technology: GOB is a protective enhancement applied after an SMD LED module has been assembled. A transparent protective adhesive layer covers the LED surface while the underlying SMD LED package structure remains unchanged. This added surface layer improves resistance to dust, moisture, static electricity, accidental contact, impact, and LED damage while maintaining the mature production advantages, broad component availability, and repairability of SMD technology. GOB should therefore be understood as a protected SMD module solution rather than the same packaging process as COB or MIP.

Lead Time & Fulfillment

• 3–5 business days: PI-G indoor standard modules, PIF-G P1.579 and P1.875 240×120mm flexible modules, and PO-G P2 and P2.5 outdoor modules.
• 15–20 business days: PI-GI 320×480mm integrated modules, PIF-G P1.25 240×120mm flexible modules, and PIF-G P1.25, P1.53, and P1.86 320×160mm flexible modules.
• Order quantities: PI-G, PIF-G, and PO-G models provide sample, standard, 200-piece, and 500-piece options. PI-GI integrated modules have a minimum order quantity of 100 pieces.
• Estimated shipping time: Standard delivery takes 9–18 business days, while express delivery takes 5–9 business days. For faster delivery, express options such as DHL / UPS / FedEx may be available depending on destination and order quantity.
• Shipping terms: DDP TERM (all fees included), except for destination countries where this shipping service is unavailable. In such cases, we will contact the buyer if this term does not apply to their destination.

Bulk purchasing, sample testing, engineering procurement, system integration, channel supply, custom display development, and project-based delivery are supported.

Selection & Compatibility

• PI-G standard and PI-GI integrated modules: Choose PI-G for flat indoor LED video walls requiring a standardized 320×160mm format, front-service maintenance, fine-pitch image quality, and enhanced surface protection. Choose PI-GI for projects requiring a larger 320×480mm integrated structure, simplified assembly, fewer module connection points, and front-service installation.
• PIF-G flexible and PO-G outdoor modules: Choose PIF-G for curved LED walls, columns, arches, immersive spaces, museums, exhibition displays, experience centers, and creative structures requiring front or rear bending capability. Choose PO-G for high-resolution outdoor displays requiring ≥5000-nit brightness, GOB surface protection, front IP65 protection, screw-lock installation, and rear-service maintenance.
• GOB protection and technology: GOB modules retain individually packaged SMD LED devices beneath a protective adhesive layer. This layer improves resistance to surface impact, dust, moisture, static electricity, and accidental contact, but complete protection still depends on the rear structure, cabinet design, sealing method, and installation environment. GOB is different from COB, where bare LED chips are mounted directly onto the PCB and encapsulated at board level.
• System compatibility: The same pixel pitch or module size does not guarantee compatibility. Module resolution, SMD LED package, GOB surface structure, scan mode, driver IC, data interface, power connection, control system, cabinet structure, bending direction, installation method, calibration data, and production batch must also match.

For replacement, repair, display expansion, sample testing, or custom project requirements, please CONTACT US before ordering and provide the required pixel pitch, module dimensions, display shape, installation environment, maintenance method, control system information, and photos or specifications of any existing modules.